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The ongoing battle between TSMC and Samsung continues to heat up. In recent years, TSMC has consistently secured key contracts with Apple, including the A12 chip for iPhones and the next-generation Snapdragon 855 chips for Qualcomm. This dominance has not gone unnoticed by Samsung, which is now reportedly launching a secret initiative known as the "Kinchnan Plan" to develop advanced semiconductor packaging technologies in an effort to reclaim Apple's mobile chip orders in 2019.
Apple's A9 processor, used in the iPhone 6s series back in 2015, was split between TSMC and Samsung. However, after the "chipgate" controversy, Apple began exclusively relying on TSMC for its most advanced processors, including the A10 Fusion in the iPhone 7, the A10X in the 2016 iPad Pro, and the A11 Bionic in the iPhone 8 and iPhone X. Analysts believe that TSMC's superior packaging technology played a crucial role in winning these contracts.
TSMC was the first in the world to commercialize the fan-out wafer-level package (InFOWLP) with integrated application processors. While both TSMC and Samsung are comparable in front-end wafer manufacturing, TSMC's InFOWLP technology significantly reduced the thickness of Apple’s processors, leading Apple to favor TSMC for its production. Samsung, which had previously focused more on the front-end process, has now realized the critical importance of back-end packaging.
According to a report from South Korea’s ETNews, following the appointment of new co-CEO Kim Jinnan, Samsung secretly launched the "Kinchnan Plan." The initiative involves substantial investment in developing a new "Fan-Wafer Wafer Level Packaging" (Fo-WLP) process. The project is being overseen by Oh Kyung-seok, a former Intel executive. Samsung aims to catch up with TSMC in producing Apple’s next-generation chips and plans to begin mass production of this new process by 2019. With the semiconductor industry becoming increasingly competitive, both companies are pushing forward with innovation to stay ahead.