"Lithium-ion Battery Specifications for Electric Bicycles" published by the industry standard The Ministry of Industry and Information Technology approved the publication of the "Lithium-ion battery specification size for electric bicycles" industry standard "Lithium-ion battery product specification size for electric bicycles" (QB/T 4428-2012) industry standard by the Ministry of Industry and Information Technology of the People's Republic of China The announcement of the 70th Announcement in 2012 was approved and will be formally implemented from June 1, 2013. The standard standardizes external lithium-ion battery products used in non-folding electric bicycles in terms of external dimensions, nominal voltage, mounting methods, and charging and discharging interfaces.

In order to increase the promotion of lithium-ion battery products for electric bicycles and improve the applicability, quality, and safety performance of battery products, the Ministry of Industry and Information Technology began to organize the research and development of "Lithium-ion Battery Product Specifications for Electric Bicycles" at the end of 2011. . The implementation of this standard will play a positive role in increasing the proportion of lithium-ion batteries used in electric bicycles and reducing the production cost and after-sales service pressure. For consumers, the unification of lithium-ion battery specifications for electric bicycles has expanded the range of consumer choices for battery products, helping battery companies and products with better technical performance to stand out and promoting the technical level of lithium-ion battery products for electric bicycles. The promotion.

HDI PCB or High density interconnect PCBs are a way of making more room on your printed circuit board to make them more efficient and allow for faster transmission. It's relatively easy for most enterprising companies that are using printed circuit boards to see how this can benefit them.

High density interconnect (HDI) PCBs represent one of the fastest-growing segments of the printed circuit board market. Because of its higher circuitry density, the HDI PCB design can incorporate finer lines and spaces, smaller vias and capture pads, and higher connection pad densities. A high-density PCB features blind and buried vias and often contains microvias that are .006 in diameter or even less.

 

The copper is the circuits material and the circuits designed by the PCB designers. Depends on the current in the circuits, the PCB copper thickness could be done with 0.5oz-10oz. But the PCB designers need be noted that the copper track width/space need be enlarged with the thickness. For example, the minimum copper track width/space could be 3mil/3mil with 0.5oz, but would be 4mil/4mil with 1oz.

 

The PCB board could be rigid PCB, could be flex PCB and also could be Flex-Rigid PCB. And the materials could be FR4, PI, Aluminum, Copper-based, Rogers, Teflon, etc. They have different applications. For example, FR4 PCB is the most commonly used for rigid PCB and almost good for all electronics products; PI is the most commonly used for flex PCB; Aluminum and copper-based have good thermal diffusivity and always used for LED PCB ; Rogers PCB and Teflon PCB are always used for High Frequency PCB, etc.

 

PCB Manufacture Capabilities

 

Features 

 Capabilities

Layers

1-36 layers

Material

 FR-4, Aluminum, Copper, Polyimide, high frequency (Rogers, PTEE, PI), etc.

PCB Type

FR-4 Standard PCB , Aluminum PCB , Copper-based PCB, HDI PCB, Rigid-Flex PCB, Flex PCB, Thick Copper PCB and Rogers PCB, etc.

Board Thickness

0.1mm-6.0mm

Copper Thickness

1/2oz-6oz(18um-210um)

Biggest Board size

600mm*1200mm

Min Tracing/Spacing

0.075mm/0.075mm (3mil/3mil)

Min drilling Hole diameter

0.15mm(6mil), 0.1mm(4mil)-laser drill

Solder Mask

Green, Black, White, Red, Yellow, Blue and Purple, etc.

Silkscreen color

White, Blue, Black, Red, Yellow

Surface finish

HASL Lead free, Immersion Gold (ENIG), Immersion Tin, Immersion Silver, OSP, Carbon oil, etc.

Special Techniques

Impedance Control, Gold Fingers, Blind/Buried vias, Peelable solder mask, Half holes, Via-in-Pad and Countersink hole, etc.


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