[Text / high-tech LED Zhao Hui] With the slowdown in the growth of demand for downstream lighting applications and the large-scale expansion of upstream epitaxial chip companies in the past two years, the competition for domestic LED chips and packaged devices has entered a hot stage. . In the field of chips, flip-chip technology is emerging, especially in the high-power, outdoor lighting applications market. As we all know, flip chip efficiency is higher, the drive current range is wide, and the high current impact resistance is excellent, which is about twice the rated current of the existing dress chip. At the same time, as flip-chip LEDs are gradually gaining attention from the lighting market, more and more LED manufacturers are beginning to invest in R&D and production in this field in an effort to accelerate the development of flip-chip technology in lighting applications in terms of technology and cost. LED flip chip combines the advantages of pre-loaded chips and vertical chips, and has broad application prospects in general lighting, automotive, high-power lighting, large-size backlights, projectors, flashlights and other fields. International companies such as Philips, Cree, and Osram have all embarked on the technical route of LED flip chip. As one of the leading LED chip manufacturers in China, Huacan Optoelectronics also regards flip chip as an important part of its “core†strategy. In the recent 2015 Golden Globe Awards, Huacan Optoelectronics won the Flip Chip Gold Globe Award for its flip-chip LED chip lifting technology. Huacan Optoelectronics has accumulated many years of experience in flip-chip research and development, and has comprehensively proposed the flip-chip "Yao" series--white-light flip-chip LED chip. On the one hand, through technology optimization, it has made further breakthroughs in light efficiency and continuously improved in package reliability protection. On the other hand, chip-level fluorescent coating is achieved for direct COB applications. It is understood that Huacan Optoelectronics has realized the industrialization of high-power flip-chip LED chips. The medium-power flip-chip has a main wavelength of 455±5 nm and a driving current of 180mA. The blue light power is ≥320mW, and the power conversion efficiency is ≥60%. Under Tc=5000K, Ra>80,180mA driving current, medium power chip scale package white LED light effect ≥155lm/W, light source module light efficiency>140lm/W; Since flip chip does not need gold wire interconnection and can be directly mounted on various substrate surfaces (PCB, ceramics, etc.), it is especially suitable for chip-level packaging (white packaging is completed directly at the chip manufacturing stage) to form chip-level white light. LED device. Because flip chip heat dissipation, high reliability, and high current drive, it has a high cost performance, so "flip chip + chip scale package" has become the perfect combination, in terms of LED white light device cost and reliability Has a strong advantage, has become the mainstream direction of the development of the LED industry in the past two years. The key prerequisite for the core of chip-level packaging is the development of flip-chip. From the current market trend, Japan, South Korea, Europe, the United States, Taiwan and other companies have successively launched flip-chip LED chips and chip-scale package products, further demonstrating the future development potential and outstanding technology of chip-level package products realized by flip chip. Advantage. As the LED lighting market gradually matures and other various application markets come, there will be a large market space for chip-scale packaged LED products in the future.
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