Automotive Switch
Automotive Switches
Automotive Switches,ie, Car Switches are gradually enjoy a lager popularity in the Automobile industry , including Automotive Push Button Switches, Automotive Toggle Switches, Automotive Rocker Switches, Automotive Rotary Switches, Automotive Battery Switches,Automotive Plunger Push Button Siwtches.
It has a very unique design and IP65 waterproof, even in harsh environments.The Push Button Switch is designed to withstand harsh environments while being subjected to high rates of actuation.Examples of such can be found in material handling equipment such as loaders, lift trucks, bucket and shovel, and other applications where positioning of the load is critical.
Our Car Electrical Switches could equip with LED light or without light, which is according to our customer`s requirement. Meanwhile, our Automotive Push Button Switches could reach IP 67 waterproof rating. We have different shape of Automotive Electrical Switches for you to choose, comprising Square and Round.
Our Automotive Switches is normally used to turn on the car, and it is normally use the High Current to conduct the engine.
Automotive Switches,Automotive Toggle Switches,Automotive Toggle Switch,Automotive Electrical Switches,Automotive Accessory Switches YESWITCH ELECTRONICS CO., LTD. , https://www.yeswitches.com
Molex once again participated in the 2014 Shanghai Electronics Show (ElectronicaChina2014), which took place from March 18th to 20th at the Shanghai New International Exhibition Center. The event showcased a wide range of Molex products across multiple industries, including automotive, industrial, datacom, medical, and mobile sectors. As one of the world’s leading connectivity solution providers, Molex displayed its latest interconnect technologies, many of which are manufactured in its facilities in Chengdu and Shanghai.
Visitors were invited to visit Molex's booth #3438 in the W3 hall to explore a variety of innovative products. In addition, Molex shared insights and expertise at the Medical and Connector Innovation Forum during the show, highlighting its commitment to supporting Chinese industry with tailored solutions that help accelerate time-to-market in today’s competitive environment.
Larry Wagner, Director of Global Market Communications at Molex, expressed enthusiasm about the company's continued participation in the event. He emphasized Molex's strong capabilities in China and highlighted the importance of expanding into key growth areas within the region. Molex is dedicated to collaborating closely with local customers to provide reliable and efficient connectivity solutions.
At the show, attendees had the opportunity to engage directly with Molex experts and learn more about specific industry solutions. For instance, Molex's automotive interconnect solutions include the HSAutoLinkâ„¢ II hermetic system, which supports high-speed data transmission up to 5Gbps and is ideal for advanced in-vehicle infotainment, telematics, and camera systems.
In the industrial sector, Molex offers the Brad® SST™ Actuator Sensor Interface (AS-i) module, designed for use in conveyor control, packaging equipment, process valves, and other automation applications. These modules support a wide range of industrial needs.
For datacom applications, Molex introduced the compact zCDâ„¢ interconnect system, capable of handling data rates up to 400 Gbps with excellent signal integrity and EMI protection. This makes it suitable for next-generation telecom, networking, and enterprise computing environments.
In the medical field, Molex launched the HOZOXTM Electromagnetic Interference (EMI) Absorption Band and Absorbing Sheet, featuring a unique two-layer design that effectively reduces EMI noise—especially beneficial for high-frequency medical devices.
Molex also expanded its mobile interconnect portfolio with micro-SIM card sockets, designed for space-constrained devices like smartphones and tablets. These sockets offer high contact reliability and secure card retention, ensuring a smooth user experience.
During the Medical and Connector Innovation Forum, John Horgan, Senior Director of Molex’s Antenna Business Unit, presented on March 18th at 2:00 PM in Room M10, Hall W3, discussing how increasing circuit integration presents new challenges in packaging. He explained how Laser Direct Structuring (LDS) technology can help integrate electronic circuits with plastic components, offering an innovative solution for complex designs.
On March 19th at 2:00 PM, Mark Schuerman, Molex Regional Business Development Manager, spoke at the same venue on "Leading Automation Trends and Connector Markets." He discussed how companies are increasingly focusing on local production and rapid response to market changes. His presentation explored the impact of these trends on automation strategies and how Molex's innovations in connectivity can help businesses stay competitive in a fast-evolving global landscape.