In the future, the design of embedded systems is encountering increasingly complex challenges in terms of performance, cost, power consumption, size, new features, and efficiency. However, a promising solution is emerging—intelligent integration of analog components with ARM microcontroller cores. Unlike traditional analog integration, this new approach offers ultra-high performance and is specifically optimized to address system-level issues. While different markets may prioritize these improvements differently, the ability to meet multiple requirements simultaneously is highly desirable and can be achieved through the integration of multiple discrete components. Logically, combining multiple devices can help achieve many of the goals of embedded systems, but simply packaging several discrete components with a single processor is not sufficient. The real solution lies in intelligent integration, which involves a more sophisticated and tailored approach. Intelligent Integration of Analog and Digital Integrating high-performance analog components such as amplifiers, ADCs, DACs, voltage references, temperature sensors, and wireless transceivers with ARM 32-bit processor cores, along with the right digital peripherals, is becoming an unavoidable solution. To build the optimal mixed-signal control processor, it's essential to have a deep understanding of the entire system, access to the correct intellectual property (IP), and expertise in integrating that IP. Chip designers and system engineers must have a solid grasp of the final application requirements. This knowledge is critical, including an in-depth understanding of board-level factors like size, temperature range, manufacturing considerations, power consumption, cost, and companion components in the signal chain. Figure 1 illustrates the common analog and data IP blocks used in smart-integrated devices. Figure 1. Smart Integration: Modular Combined IP Optimized for Target Applications Having the right intellectual property available is a strong starting point for achieving system-level goals. This foundation is crucial for shortening the development cycle of mixed-signal control processors. As the industry evolves, the acquisition, formation, and implementation of IP for specific applications are increasingly coordinated by semiconductor manufacturers. These IP modules must be adjusted to meet two key requirements: first, to optimize performance and operation based on the main target application, maximizing system benefits; second, to ensure compatibility with other complementary IP modules within the mixed-signal control processor. Finally, there is a need for business-level coordination between system manufacturers and semiconductor companies to combine their expertise and knowledge, leading to unique and optimized designs. Mixed-Signal Control Processor Applications Many applications benefit from devices that integrate high-performance analog and ARM microcontroller cores, including temperature sensing, pressure sensing, gas detection, solar inverters, motor control, medical vital signs monitoring, automotive monitoring systems, and water, electric, and gas meters. This article will focus on two specific areas where the integration of high-performance analog and ARM cores provides significant advantages in cost, power consumption, size, and performance: 1. Solar photovoltaic (PV) inverters, aiming to increase efficiency, reduce BOM costs, and integrate intelligence for smart grid connectivity. 2. Motor control, focusing on improving efficiency for environmental protection and reducing costs. Although these intelligent integrated mixed-signal devices are optimized for specific end applications, they are also well-suited for related applications with similar functional requirements. Solar PV Inverters: Reduce Costs to Expand Applications, Integrate Intelligence for Smart Grids Over the past five years, the annual growth rate of solar PV systems has exceeded 50%, yet its share of global installed power remains relatively small. While solar PV has reached grid parity in some regions, in most areas, it still depends on government subsidies. To compete with traditional energy sources like natural gas, coal, and oil, the best way to lower the cost of solar PV is to improve efficiency and reduce system BOM costs. On one hand, the cost and efficiency of solar panels are moving in the right direction. On the other hand, new technologies provide guarantees for the advancement of solar PV inverters, which act as the interface between solar panel power generation and the grid. These technologies include NPC Class 3/5/Multi-level topologies, high-frequency switching using fast power transistors made from silicon carbide (SiC) and gallium nitride (GaN). Figure 2 shows a two-stage solar PV inverter system. The DC energy from the panel is converted into AC to feed into the grid. The first stage is a DC-DC conversion that raises the voltage level to match the grid peak. The second stage is a DC-AC conversion. The area marked in red represents a low-voltage control element that, when combined with a single mixed-signal control processor, delivers system-level benefits. By integrating multiple components into a single device, the efficiency of the new high-speed switching topology helps reduce costs. As a result, the installed cost per kW is lowered. Additionally, a smaller inductor can be used, further cutting costs. This not only reduces BOM costs but also minimizes the inverter’s size.

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