In the future, the design of embedded systems is facing complex challenges in terms of performance, cost, power consumption, size, new features, and efficiency. However, a promising solution is emerging—intelligent integration of analog components with ARM microcontroller cores. Unlike traditional analog integration, this approach offers ultra-high performance and is specifically optimized to address system-level issues. While different markets may prioritize these improvements differently, the need to meet multiple criteria simultaneously is highly desirable and can be achieved through the integration of multiple discrete components. Logically, combining several devices can help achieve many of the goals of embedded systems, but simply packaging multiple components with a single processor isn't sufficient. The real solution lies in intelligent integration, which requires a deeper level of system understanding and expertise. Intelligent integration of high-performance analog components—such as amplifiers, ADCs, DACs, voltage references, temperature sensors, and wireless transceivers—with ARM 32-bit processor cores, along with the right digital peripherals, represents a necessary evolution in system design. To build the optimal mixed-signal control processor, designers must have a deep understanding of the entire system, access to the right intellectual property (IP), and the expertise to implement it effectively. It’s clear that chip designers and system engineers responsible for developing functional requirements for these integrated devices must have a solid grasp of the final application needs. This knowledge includes an in-depth understanding of board-level requirements such as size, temperature range, manufacturing considerations, power consumption, cost, and companion components in the signal chain. Figure 1 illustrates the analog and data IP blocks commonly used in intelligent integrated devices. Figure 1: Smart integration – modular combined IP optimized for target applications Having the right intellectual property available is a crucial starting point for achieving system-level goals. This foundation is essential for shortening the development cycle of mixed-signal control processors. Increasingly, the acquisition, formation, and implementation of IP for specific applications require coordination between semiconductor manufacturers. These IP blocks must then be adjusted to meet two key requirements: first, optimizing performance based on the main target application to maximize system benefits; second, ensuring compatibility with other complementary IP modules within the mixed-signal control processor. Finally, there is a need for business-level coordination to combine the expertise of system manufacturers and semiconductor companies, enabling unique and optimized designs. Mixed-signal control processors find applications in various fields, including temperature sensing, pressure sensing, gas detection, solar inverters, motor control, medical vital signs monitoring, automotive monitoring systems, and water, electric, and gas meters. This article will focus on two specific areas where the integration of high-performance analog and ARM microcontroller cores provides significant advantages in terms of cost, power consumption, size, and performance: 1. Solar photovoltaic (PV) inverters, aiming to increase efficiency, reduce BOM costs, and integrate intelligence to support smart grid connectivity. 2. Motor control, aiming to improve efficiency for environmental benefits and reduce costs. While these intelligent integrated mixed-signal devices are optimized for specific end applications, they are also well-suited for related applications with similar functional requirements. Solar PV Inverters: Reduce Costs to Expand Applications, Integrate Intelligence for Smart Grid Support Over the past five years, the annual growth rate of solar PV systems has exceeded 50%, yet its share of global installed power remains relatively small. Although in some regions, solar PV generation has reached cost parity with fossil fuel sources, this goal is still not widespread and largely depends on government subsidies. To improve competitiveness against traditional energy sources like natural gas, coal, and oil, the best way to reduce the cost of solar PV power generation is to boost efficiency and lower the system's BOM cost. On one hand, the cost and efficiency of solar panels are improving in the right direction. On the other hand, new technologies are driving advancements in solar PV inverters—the interface between solar panel power generation and the grid. These technologies include NPC Class 3/5/Multi-level topologies and high-frequency switching using fast power transistors made from silicon carbide (SiC) and gallium nitride (GaN). Figure 2 shows a two-stage solar PV inverter system. The electrical energy from the panel, essentially a DC source, is converted to AC for grid connection. The first stage is a DC-DC conversion that raises the voltage to match the grid peak voltage. The second stage is DC-AC conversion. The area marked by the red line represents a low-voltage control element, which, when combined with a single mixed-signal control processor, delivers system-level benefits. By integrating multiple components into a single device through a more efficient high-speed switching topology, cost savings are achieved. As a result, the installed cost per kW is reduced. Additionally, a smaller inductor can be used, further lowering costs. This not only reduces BOM expenses but also minimizes the inverter's size.

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