Beijing, December 10, 2012-Broadcom Corporation (Nasdaq: BRCM), a global leader in innovative solutions for wired and wireless communications semiconductors, announced the launch of optimized smartphones for the Android 4.2 Jelly Bean operating system platform. This 3G platform using the BCM21664T 1.2GHz HSPA + cellular baseband processor demonstrates its powerful processing capabilities and performance, and the data transmission rate is faster. The BCM21664T and its turnkey design solution are the industry ’s first HSPA + dual-core processors for entry-level smartphones. It integrates Broadcom ’s technology-leading connection sleeves. These combinations were previously only available for higher-end Android smartphones.

Broadcom launches a smartphone platform specifically optimized for the Android operating system

As demand for entry-level smartphones grows, so does the demand for more features and high-quality mobile broadband experiences. Users expect to be able to run applications, download files, and share data stream content on their phones at the same time. The new BCM21664T platform has an ARM Cortex A9 dual-core processor, which enhances graphics and image processing capabilities and improves the user experience under the Android 4.2 operating system. The chip is a complete system solution, including a radio frequency unit (RF), a power management unit (PMU) and an advanced connection combination.

Industry evaluation

Jeff Orr, director of equipment and applications business at ABI Research: "The combination of the expanding Android ecosystem and the complete platform provided by semiconductor manufacturers like Broadcom will allow more consumers to use affordable high-performance smartphones. By adding an advanced processor that supports HSPA + technology to the 3G smartphone platform product portfolio, Broadcom will improve the user experience of the Android Jelly Bean operating system, enabling users to better share and connect. "

Rafael Sotomayor, vice president of mobile platform solutions at Broadcom: "As the first dual-core HSPA + platform for entry-level Android smartphones, BCM21664T not only provides a better mobile experience, faster download speeds, but also a growing Low-cost smartphones have established a new standard. Mainstream consumers will continue to choose affordable smartphones, and their expectations for the mobile phone experience will continue to grow. Broadcom ’s new chipset platform will help mobile phone manufacturers make full use of the mobile Internet Expansion to provide stronger functionality at a lower cost. "

Product details :

The downlink rate can reach 21.1 Mbps, and the uplink rate can reach 5.8 Mbps;

Graphics processing capacity exceeds 20GFLOPS, can support 720p HD recording and full HD 1080p playback and other graphics functions;

Miracast technology can support wireless HD playback;

The industry's lowest power consumption 3G / 2G dual SIM card dual standby design can meet the needs of the global market;

Complete reference design, including schematics, tools, software, and operator-specific functions.

Supply :

BCM21664T is currently in the sample stage and is expected to be mass-produced in the first half of 2013 in the second quarter.

About Broadcom

Broadcom, a Fortune 500 company, is an outstanding technology innovator and leader in the global wired and wireless communications semiconductor industry. Its products assist the transmission of voice, video, data and multimedia throughout the home, enterprise and mobile environment. For manufacturers of information and network equipment, digital entertainment and broadband access products, and mobile devices, Broadcom provides the industry's most complete advanced system-on-a-chip and embedded software solutions. These solutions support our core belief: ConnecTIng Everything®.

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