AVX offers multi-layer organic (MLO?) duplexers in heights 0603 and 0805

Photocoupler

AVX, a top-tier manufacturer of passive components and interconnect solutions, has introduced the smallest height 0603 and 0805 MLOTM duplexers available on the global market. These compact duplexers from AVX outperform similar low-temperature co-fired ceramics (LTCC) in key areas such as superior attenuation, minimal insertion loss, reduced parasitic effects, enhanced thermal dissipation, and improved solderability. Their ultra-thin profiles—measuring just 0.42mm (0.017") for the 0603 and 0.55mm (0.021") for the 0805—make them ideal for applications requiring space efficiency.

Larry Eisenberger, senior market applications engineer at AVX, stated: "Our advanced 0603 and 0805 MLO duplexers are currently the lowest-profile options available in the industry. They offer significant advantages to engineers working on next-generation mobile devices that require high performance in a small form factor."

The 0603 and 0805 MLO duplexers leverage AVX’s patented multilayer organic high-density interconnect technology, along with high-Q printed passive components made from materials with higher dielectric constants and lower insertion loss. This includes multilayer-stacked inductors and capacitors. The design ensures a thermal expansion coefficient that closely matches that of printed circuit boards, offering better reliability compared to traditional ceramic or silicon-based components.

These best-in-class low-profile duplexers are designed to operate within a wide temperature range of -40°C to +85°C. They support maximum power levels of 4.5W and 5W, respectively, and undergo 100% electrical performance and visual testing. The components are available with nickel-plated gold, nickel-tin, or OSP (organic solderability preservative) finishes, making them fully compatible with automated soldering processes.

Whether you're designing for WiFi, WiMax, 3G/4G LTE, or GPS applications, AVX's MLO duplexers provide an optimal balance of performance, size, and reliability, helping engineers meet the evolving demands of modern wireless systems.