With the continuous advancement of solid-state lighting technology, COB (chip-on-board) packaging technology has received more and more attention. Because COB light source has low thermal resistance, high luminous flux density, less glare, uniform illumination, etc., indoors and outdoors. Lighting fixtures have been widely used, such as downlights, bulbs, fluorescent tubes, street lamps and mining lamps.
This paper describes the advantages of COB packaging over traditional LED packaging. It mainly compares manufacturing manufacturing efficiency advantages, low thermal resistance advantages, optical quality advantages, application advantages and cost advantages. It shows that COB packaging is developing in the future LED lighting field. leading position.
1. Manufacturing efficiency advantage
The COB package is basically the same in the production process as the traditional SMD production process. In the solid crystal, the wire bonding process and the SMD package efficiency are basically the same, but in the dispensing, separation, spectroscopic, packaging, the efficiency of the COB package is better than the SMD class. The product is much higher. The traditional SMD package labor and manufacturing costs account for about 15% of the material cost. The COB package labor and manufacturing costs account for about 10% of the material cost. With COB packaging, labor and manufacturing costs can be saved by 5%.
2. Low thermal resistance advantage
The thermal resistance of the system in traditional SMD package applications is: chip-solid glue-solder joint-solder paste-copper foil-insulation-aluminum. The thermal resistance of the COB package system is: chip-solid glue-aluminum. The system thermal resistance of COB package is much lower than that of traditional SMD package, which greatly improves the life of LED.
3. Light quality advantage
Traditional SMD packages use a patch to attach multiple discrete devices to a PCB to form a light source component for LED applications. This practice has problems with spotlight, glare, and ghosting. Because the COB package is an integrated package, it is a surface light source with a large viewing angle and easy adjustment, reducing the loss of light refraction.
4. Application advantages (taking fluorescent tube COB as an example)
It can be seen from the above figure that the COB light source eliminates the process of patching and reflow soldering on the application side, which greatly reduces the production and manufacturing process of the application end, and at the same time saves the corresponding equipment, and the production equipment has lower input cost and production. higher efficiency.
Taking the current 1.2m 2000LM fluorescent tube as an example, about 288pcs 3528 light source is required, the mounting cost is about 0.01 yuan RMB/pcs, and a 1.2m fluorescent tube patch mounting cost is
288 * 0.01 = 2.88 yuan, such as the use of COB light source will save this cost.
5. Cost advantage
(1) Take a 1.2m fluorescent tube as an example (light source part)
As can be seen from the above table, with the COB light source, the cost of the whole lamp 1600lm solution can be reduced by 24.44%, the cost of the whole lamp 1800lm solution can be reduced by 29%, and the cost of the whole lamp 2000lm solution can be reduced by 32.37%.
(2) Take 7W bulb/downlight as an example (light source is 6W)
It can be seen from the above that the use of COB can reduce the cost of using conventional SMD light sources by 19% to 32%, thereby greatly reducing the cost of LED finished products, which will facilitate the popularization of LED lighting as soon as possible.
to sum up:
The use of COB light source has five advantages over traditional SMD packaged light source. It has great advantages in light source production efficiency, thermal resistance, light quality, application and cost. The comprehensive cost can be reduced by about 25%, and the device is simple and convenient. The process is simple. With the increasing use of LEDs in the field of lighting, from the perspective of cost and application, the integrated COB package is more suitable for the next-generation LED lighting structure. The development of COB package is to solve the high thermal resistance in the existing SMD package structure. The main way of high cost issues. The number of COB packages will gradually increase in the proportion of LED packages with its excellent performance, especially the increase in the proportion of output value, which further promotes the popularity of LED lighting.

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